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氮化铝(AlN)基板

Zhengtian New Materials Company focuses on high-performance silicon nitride, aluminum nitride ceramic substrate, research and development, production, sales and service as one, core equipment independent research and development, equipment process and material process integration, and can quickly make process adjustments according to customer feedback and customized needs.
The self-developed casting machine can make the surface of the substrate more smooth and flat; Cutting edges and corners without burrs; The sintering furnace generally increases the strength of the substrate by 25%.
Our AlN products, with good thermal conductivity, high electrical insulation and close to silicon thermal expansion coefficient and other characteristics, are widely used in power transistor module substrates, LED loading substrates, IC packaging.
High thermal conductivity greater than 170 (up to 200) W/m⋅K Instant firing process:strength up to 570Mpa Surface roughness Ra:Grinding process -0.6um, Instant firing process-less than 0.3um

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