正天新材料の窒化ケイ素基板技術は国際一流レベルに追いつきました
With the development of integrated circuits, the integration level and power density of semiconductor devices have significantly increased. Consequently, the heat generated by corresponding operations has dramatically risen. According to statistics, as high as 55% of high-power device failures are caused by heat. To address the heat dissipation issue in circuits, it is essential to first identify the components within the electronic packaging system that affect heat dissipation. As the carrier of integrated circuit chips, the substrate is in direct contact with the circuit, and thus the heat generated by the circuit needs to be dissipated outward through the substrate. In order to facilitate better heat dissipation for the circuit, […]