Aluminum Nitride and Silicon Nitride Ceramic Substrates Enable Efficient Heat Dissipation and Thermal Management Innovation in Power Semiconductors
With the continuous advancement of power semiconductor technology, efficient heat dissipation solutions have become increasingly important, especially in high-power, high-density applications such as electric vehicles, industrial automation, and 5G communication. Ensuring device stability and prolonging its lifespan have become key factors for industry development. In recent years, aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic […]